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- Contact：肖先生
- Phone：0755-28152368
- Email：3230660652@qq.com
- fax：0755-28152398
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 & Shenzhen solder paste wholesale, Shenzhen solder paste factory, Shenzhen solder paste wholesale, when buying solder paste, Utel solder paste is the first choice, introducing foreign equipment, imported materials, merging Chinese and Western technologies, strong innovation ability, American and Japanese products, we It is an innovator of solder paste. With the same alloy composition, Utel solder paste can help you save % of costs and create % of profits. The product performance is superior and the after-sales service is more perfect!
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For lead-free solder paste, since the melting point of the alloy is ~°C or even higher than the temperature of lead-based solder paste, the soldering temperature will rise and the energy consumption will increase. Some electronics The components cannot withstand such high temperatures and cause damage, so they cannot be directly used in existing production processes and equipment.
It is difficult to accurately control the alloy composition of quaternary or even quintuple alloys during wave soldering production, and it will also become difficult during reflow soldering due to the multi-component alloy. There is not much research and development on the system technology and solder paste supporting the new lead-free solder paste, causing the cost of lead-free solder paste to be significantly higher than that of lead-based solder paste.
Compared with b assembly, lead-free rework requires higher temperatures and longer heating times. Since lead-free surface assembly will have a greater impact on the manufacturing process, lead-free solder paste processes and equipment need to be adjusted accordingly.
The most important point is the issue of reliability. The increasingly higher reliability requirements of electronic products, in addition to further improving the performance requirements of the components themselves, also require the joint connection material (i.e., solder paste) to have good physical properties (electrical conductivity, thermal conductivity), thermal matching ability, and good Mechanical properties (joint creep resistance, thermal fatigue resistance), service performance (corrosion resistance, good process performance) and environmental compatibility, etc.
Brazed electronic structures usually have the following problems during service: mismatch of thermal expansion coefficient, thermal fatigue, mechanical fatigue, creep, organizational instability, corrosive environment, etc. The existence of these problems makes the brazed joints likely to fail prematurely during service.
The comprehensive lead-free process in the electronics industry requires that the B pads and component connection terminals or leads used as assembly objects must also be completely lead-free and must be compatible with the new lead-free solder paste. Therefore, there is still a long way to go to achieve comprehensive lead-free.
With the miniaturization of components and the development of surface assembly technology, the microstructural stability, mechanical properties, especially creep resistance of soldered joints used in the electronic information industry have become increasingly important. There are higher requirements. Nowadays, the whole world is committed to researching lead-free solder. Until now, no ready-made material has been found that can be used as a substitute for lead-containing solder paste. In order to improve the service capabilities of lead-free solder paste, much research focuses on adding nano-scale or micron-scale reinforced particles to lead-free solder paste to create composite solder paste. The purpose of developing composite solder paste is to improve the effective operating temperature range of the solder paste by maintaining a stable fine-grained structure and uniform deformation inside the solder paste, thereby comprehensively improving the performance of the soldered joint, especially the resistance to thermal fatigue and Creep resistance. Therefore, the development of lead-free composite solder paste can be said to be an effective way to find alternatives to B. Lead-free solder paste is also developed based on considerations of service reliability.
Contact address: Building, Tumao Industrial Park, Hebei Industrial Zone, Hualian Community, Longhua Street, Longhua District, Shenzhen
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| Company Name： |
Shenzhen Uptel Technology Co |
Company type： |
企业单位 (制造商) |
| location： |
Guangdong/Shenzhen |
Company Size： |
50-99人 |
| Registered capital： |
50M人民币 |
Registration year： |
2008 |
| Data certification： |
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| Security deposit： |
Already paid 0.00 元 |
| Operation model： |
制造商 |
| Business Scope： |
lead free solder paste, leaded solder paste, halogen free solder paste, led strip solder paste |
| products sold： |
无铅锡膏，有铅锡膏，无卤素锡膏 |
| major business： |
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